ME-PCMs Phase Change Material

ME-PCMs is a microencapsulated phase change material designed for thermal-management applications where PCM needs to be incorporated into a polymer matrix.

The PCM core is enclosed within a polymer shell. During thermal cycling, the phase-change process takes place inside the microcapsules, helping retain the PCM within the particle structure.

This design allows ME-PCMs to be incorporated into silicone, epoxy, rubber and other polymer-based materials, making it particularly suitable for battery potting and composite thermal-management applications.

Compared with TX-PCMs, ME-PCMs focuses more on formulation flexibility and compatibility with polymer processing rather than maximum thermal conductivity.

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Product Specifications

Parameter	ME-PCMs
Material Type	Microencapsulated PCM
Structure	Organic PCM Core + Polymer Shell
Appearance	Fine White Powder
Phase-Change Temperature	5–58°C, customizable
Recommended Battery Range	28–35°C
Temperature Tolerance	±1°C
Latent Heat	100–130 J/g
Thermal Conductivity	0.22–0.30 W/m·K
Particle Size	D50 10–30 μm
Thermal Cycling	≥5,000 cycles
Latent-Heat Retention	>90%
Processing	Silicone / Epoxy Blending / Potting / Coating
Customization	Temperature / Particle Size / Formulation

Specifications may vary according to formulation, processing conditions and test methods.

Key Benefits

•Microencapsulated Structure
The PCM core is enclosed by a polymer shell. This structure is designed to reduce direct exposure of the phase-change material to the surrounding matrix and minimize liquid leakage concerns during phase transition.

•Designed for Potting & Composite Processing
ME-PCMs can be blended into silicone, epoxy, rubber, polymer composites and thermal-management coatings, making it suitable for battery-module potting and other composite thermal-management processes.

•Fine Particle Size
Standard particle size is D50: 10–30 μm. Particle size can be customized according to formulation and processing requirements.

•Passive Thermal Buffering
During heating, ME-PCMs absorbs thermal energy through its phase-change process. This provides a passive thermal buffer that can help moderate transient temperature fluctuations in the surrounding system.

•Long Cycling Performance
The current product specification indicates ≥5,000 thermal cycles with >90% latent-heat retention under the specified accelerated testing conditions.

•Customizable Phase-Change Temperature
Phase-change temperature can be customized within approximately 5–58°C. For battery thermal-management applications, 28–35°C can be considered as a typical development range, subject to the battery system and operating conditions.

Battery Thermal Management Applications

Battery Potting

Battery cell potting
Battery module potting
Thermal-management gap filling
Cell-to-cell thermal buffering
Composite thermal-management structures

Electric Mobility

EV battery modules
Hybrid vehicle battery systems
Electric two-wheelers
Electric motorcycles
Light electric vehicles
Compact battery systems

Energy Storage

Residential energy storage
Commercial & industrial energy storage
Portable energy storage
Solar energy storage
Off-grid energy storage
Telecom backup batteries

AGV & Robotics

AGV
AMR
Industrial robots
Service robots
Autonomous equipment

Polymer Composite Applications

Silicone-Based Composites

For flexible thermal-management and potting applications.

Epoxy-Based Composites

For rigid composite structures and battery encapsulation.

Rubber-Based Composites

For flexible temperature-buffering components.

Functional Coatings

For temperature-regulating coatings and composite materials.

Other Applications

Thermal-regulating textiles
Cold-chain packaging
Temperature-regulating building materials
Electronic component thermal buffering
Functional polymer composites

ME-PCMs vs. TX-PCMs

Feature	ME-PCMs	TX-PCMs
Material Structure	Microencapsulated PCM	Solid-Solid Composite
Main Advantage	Polymer compatibility	High thermal conductivity
Appearance	White fine powder	Black powder
Latent Heat	100–130 J/g	210–310 J/g
Thermal Conductivity	0.22–0.30 W/m·K	Up to 5 W/m·K
Phase-Change Range	5–58°C	5–120°C
Typical Battery Range	28–35°C	28–35°C
Cycle Stability	≥5,000 cycles	≥1,000 cycles
Latent-Heat Retention	>90%	>95%
Particle Size	D50 10–30 μm	—
Main Processing	Potting / Blending / Coating	Hot Pressing
Silicone / Epoxy	Recommended	Not recommended
PCM Sheet / Plate	Not recommended alone	Recommended
Main Application	Potting / Polymer Composite	PCM Sheet / Plate / Block

Material Selection

Choose ME-PCMs when your process requires:

Polymer blending
Battery potting
Silicone / epoxy compatibility
Fine particle dispersion
Flexible composite formulation

Choose TX-PCMs when your process requires:

High thermal conductivity
High latent heat
Solid thermal components
Hot-pressed PCM sheets or plates
Compact thermal-buffering structures

Customized Microencapsulated PCM Solutions

ME-PCMs can be customized according to Phase-Change Temperature, Particle Size, Latent Heat, Polymer Matrix, Processing Method and Battery Application.

We provide technical support for material selection, formulation evaluation and customized PCM development.

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